In a recent announcement, ASRock elucidated the reasons behind the CPU failures reported by users of its motherboards, particularly regarding AMD’s 9000-series chips. The company’s investigation revealed three primary scenarios leading to these failures.

The first scenario involves user error, such as thermal paste misapplication or debris entering the CPU socket. ASRock claims this affects only a small fraction of affected users.

Findings from AMD

In many instances, tests performed on CPUs returned to AMD revealed they were still operational. This situation has been attributed primarily to both memory compatibility issues and BIOS settings. ASRock’s latest BIOS update (version 3.25) attempts to address these concerns by adjusting the settings for Thermal Design Current (TDC) and Electric Design Current (EDC), which were previously too high for certain AMD chips.

Although the company is confident that these updates will resolve many underlying issues, users are encouraged to check that their motherboards are running on the latest BIOS to avoid potential complications. ASRock stated that ongoing analysis is being conducted, including tests on CPUs that exhibited damage, but as yet, conclusive results have not been returned.

This development maintains ASRock’s commitment to resolving these issues while navigating the complexities of motherboard and CPU interactions.