Intel's Nova Lake Chip Poised to Challenge AMD's X3D CPUs with Innovative Features
Hardware/Processors

Intel's Nova Lake Chip Poised to Challenge AMD's X3D CPUs with Innovative Features

The upcoming Nova Lake processor from Intel is set to challenge AMD's leading X3D CPUs, boasting a remarkable 288 MB of vertical cache and 52 cores.

Intel is gearing up to compete fiercely against AMD’s X3D CPUs with the launch of its Nova Lake processor in 2026. This chip is reported to feature an impressive 288 MB of last-level vertical cache, which significantly surpasses the 128 MB offered by AMD’s top X3D model, the AMD Ryzen 9 9950X3D.

The leak comes from the reliable source kopite7kimi, who noted that the upcoming Nova Lake will include models with dual compute tiles, doubling the cache capacity. The Nova Lake series aims at reclaiming Intel’s standing in gaming performance, especially as competition heats up with AMD’s imminent release of Zen 6 CPUs in the same timeline.

More details are expected as we approach the release which could reshape the CPU market landscape.

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