An AMD patent application concerning a new variant of DDR5 PC memory has surfaced. The proposed High-Bandwidth Dual Inline Memory Module (HB-DIMM) is intended to enhance memory bandwidth through the use of pseudo channels, buffer chips, and smart signal routing. However, skepticism remains about its imminent adoption in personal computers.

According to the patent description, the industry faces escalating memory bandwidth needs driven by high-performance graphics processors and servers, which necessitate increased bandwidth-per-core. As it stands, current DDR DRAM chip advancements may not keep pace with these demands, making innovative DIMM architectures essential to address the requirements through existing DDR chip technologies.

Summary of the Patent

The new HB-DIMM aims to utilize the benefits of High-Bandwidth Memory (HBM) in a DIMM form factor. Each HB-DIMM will predominantly comprise memory and buffer chips. The buffer chips will be linked to respective sets of memory chips and will transmit data over the host bus at a rate that is double that of the memory chips themselves.

Implementation Challenges

Nevertheless, the adoption of this new standard seems uncertain without the support of key players such as Intel, which remains a dominant force in PC platforms. To gain traction, it might be necessary for the Joint Electron Devices Engineering Council (JEDEC) to endorse the standard, making it freely accessible.

Ultimately, it will be intriguing to see if this innovative approach will materialize in the hardware market.